WAFER TEST CASSETTE, WAFER TEST SYSTEM AND WAFER TEST METHOD
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United States of America
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Issued Date -
Mar 20, 2025
app pub date -
Mar 29, 2024
filing date -
Mar 29, 2024
priority date (Note) -
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Abstract
A wafer test cassette, a wafer test system, and a wafer test method are provided. The wafer test cassette includes a first housing including a first magnetic member, a second housing including a second magnetic member corresponding to the first magnetic member, a first fluid port, and a gas supply device. The first housing and the second housing are tightly coupled to each other by which a test space is defined. The first housing includes a probe card, and the second housing carries a wafer. When the first housing and the second housing are coupled, a probe is electrically in contact with a pad of the wafer. The first fluid port is disposed in the first housing or the second housing, and receives an external gas to the test space. After the test space receives the external gas, an air pressure value thereof is greater than an atmospheric pressure.
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