WAFER TESTING CASSETTE
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United States of America
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Issued Date -
Mar 20, 2025
app pub date -
Mar 29, 2024
filing date -
Mar 29, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A wafer testing cassette is provided. The wafer testing cassette includes a first housing, a second housing and a magnetic force generating assembly. The first housing include a probe card, the probe card includes at least one probe having a paramagnetic property. The second housing is combined with the first housing and has a magnetic force generating assembly arranged corresponding to the at least one probe. A wafer located in the second housing, and the at least one probe electrically contacts at least one pad of the wafer with a predetermined contact force. When the magnetic force generating assembly is configured to generate a first magnetic attraction force, the magnetic force generating assembly attracts the at least one probe, so that the at least one probe electrically contacts the at least one pad with a first contact force which is greater than or equal to the predetermined contact force.
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