REMOVABLE HIGH-SPEED SIGNAL MEASUREMENT DEVICE
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United States of America
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Issued Date -
Mar 20, 2025
app pub date -
Sep 15, 2023
filing date -
Sep 15, 2023
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Abstract
A high-speed signal measurement system includes a printed circuit board and a measurement device. The printed circuit board includes a conductive pad. The measurement device is configured to be removably coupled to the printed circuit board. The measurement device is configured to establish an electrical connection between a conductive probe tip and the conductive pad. The measurement device includes a clamp movable between an open position in which the measurement device is configured to removably receive the conductive probe tip and a closed position in which the measurement device is configured to retain the conductive probe tip. The measurement device further includes a spring mechanism configured to exert a spring force to maintain the electrical connection between the conductive probe tip and the conductive pad when the measurement device is coupled to the printed circuit board and the clamp is in the closed position.
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