TEST SOCKET FOR A COMPONENT
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United States of America
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Issued Date -
Mar 20, 2025
app pub date -
Jul 5, 2024
filing date -
Jul 5, 2024
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Abstract
A test apparatus includes an image sensor module including a controller configured to generate a pulse width modulation signal to control a temperature of an image sensor module to be tested, and a test socket configured to emit heat to the image sensor module based on the pulse width modulation signal. The controller may control a duty ratio of the pulse width modulation signal based on a current temperature of the image sensor module, a target temperature and a criteria temperature range, and the criteria temperature range is a temperature range within a preset range from the target temperature.
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