Importance

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Abstract

A cooling system assembly may include a water block unit and liquid cooling unit. The water block unit is configured for phase-change of a first cooling fluid and the liquid cooling unit is configured to be flow through by a second cooling fluid. The water block unit includes a first thermal transfer surface and second thermal transfer surface. The first thermal transfer surface is configured to couple to a packaged integrated circuit. The liquid cooling unit includes a liquid plate heat exchanger comprising a liquid cooling water block coupled to the second thermal transfer surface. The first thermal transfer surface is thermally coupled to the packaged integrated circuit, whereby the water block unit transports heat away from the packaged integrated circuit. The liquid cooling water block is thermally coupled to the second thermal transfer surface, whereby the liquid cooling unit transports heat away from the water block unit.

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First Claim