ELECTRODEPOSITED COPPER FOIL WITH A UNIFORM MATTE SURFACE

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United States of America

APP PUB NO 20250092553A1
SERIAL NO

18779551

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Abstract

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The present invention discloses an electrodeposited copper foil with a uniform matte surface. The electrodeposited copper foil of the present invention has an average thickness (TAve) of about 30 μm to about 400 μm; and the matte surface of the present electrodeposited copper foil has a uniformity factor (UF) of 5.5 μm or less.

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Patent Owner(s)

Patent OwnerAddress
DUPONT ELECTRONICS INC974 CENTRE ROAD WILMINGTON DE 19805

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LIN, SHIH-CHING HSINCHU, TW 11 4
LIN, YA-MEI HSINCHU, TW 3 5

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges2910020406080100120140160180200220240260280300320

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