ELECTRODEPOSITED COPPER FOIL WITH A UNIFORM MATTE SURFACE
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Mar 20, 2025
app pub date -
Jul 22, 2024
filing date -
Jul 22, 2024
priority date (Note) -
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Abstract
The present invention discloses an electrodeposited copper foil with a uniform matte surface. The electrodeposited copper foil of the present invention has an average thickness (TAve) of about 30 μm to about 400 μm; and the matte surface of the present electrodeposited copper foil has a uniformity factor (UF) of 5.5 μm or less.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
DUPONT ELECTRONICS INC | 974 CENTRE ROAD WILMINGTON DE 19805 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
LIN, SHIH-CHING | HSINCHU, TW | 11 | 4 |
# of filed Patents : 11 Total Citations : 4 | |||
LIN, YA-MEI | HSINCHU, TW | 3 | 5 |
# of filed Patents : 3 Total Citations : 5 |
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