ULTRA TOUGH GLASSY THERMOSET SYNTHESIZED USING A CURABLE LIQUID RESIN
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Mar 20, 2025
app pub date -
Sep 13, 2024
filing date -
Sep 13, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Disclosed herein are polyamide substrates that may be reliably used in additive manufacturing to produce a wide variety of 3D printed articles, protective films or membranes. The polyamide substrate can be formed via thiol-ene click chemistry reactions between diallyl amide or other alkene monomers, reacted with thiol monomers, that can be activated by photoirradiation at relatively low temperatures (e.g., about 80° C.). As a result, the polyamide substrates disclosed herein may be cured using a simple, energy efficient curing process that allows for additive manufacturing where the produced 3d printed article exhibits increased toughness rather than being brittle as are most 3d printed articles.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully