SENSOR PACKAGE WITH HOLLOW STRUCTURE AND METHOD FOR ASSEMBLING SENSOR PACKAGE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250091859A1
SERIAL NO

18886428

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A sensor package includes a plurality of walls to form a hollow structure and a plurality of inner ledges extending inwardly from the plurality of walls. Further, an inner ledge is adapted to split a corresponding wall into a first part and a second part. The plurality of inner ledges divides the hollow structure in a top section defined by a top surface of the inner ledge and the first part of each of the plurality of walls surrounding the top surface and adapted to receive a die and a bottom section defined by a lower surface of the ledge and the second part each of the plurality of wall surrounding the lower surface, such that the bottom section is adapted to insulate a lower face of the die.

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Patent Owner(s)

Patent OwnerAddress
CARRIER CORPFLA FLORIDA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kerling, Jacob Minneapolis, US 3 0

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