REDUCTION OF RINGING AND INTERMODULATION DISTORTION IN A MEMS DEVICE
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United States of America
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Mar 20, 2025
app pub date -
Nov 27, 2024
filing date -
Nov 27, 2024
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Abstract
Described embodiments include a microelectromechanical system (MEMS) array comprising a first MEMS device that includes a first movable electrostatic plate elastically connected to a first structure, the first movable electrostatic plate having a first mass, a first fixed electrostatic plate, and a first drive circuit having a first drive output coupled to the first fixed electrostatic plate. There is a second MEMS device that includes a second movable electrostatic plate elastically connected to a second structure, the second movable electrostatic plate having a second mass that is different than the first mass, a second fixed electrostatic plate, and a second drive circuit having a second drive output coupled to the second fixed electrostatic plate.
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