INJECTION MOLDING SYSTEM

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250091272A1
SERIAL NO

18883372

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Abstract

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An injection molding system including an injection molding device including an injection molding section that has a fixed section to which a fixed molding die and a movable molding die are attached and fixed and that is configured to mold a molded article by injecting a material containing a metal powder into a cavity, and a first movement section for moving the movable molding die between a molding die closed position and a molding die open position, a cleaning device that performs cleaning of the molded article by blowing air, and a control device, wherein when the movable molding die is not at the molding die closed position, the control device does not cause the cleaning device to blow air, and when the movable molding die is at the molding die closed position, the control device causes the cleaning device to perfom blowing of air.

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Patent Owner(s)

Patent OwnerAddress
SEIKO EPSON CORPORATION1-6 SHINJUKU 4-CHOME SHINJUKU-KU TOKYO 1608801 ?1608801

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HORIE, Seijun Matsumoto-shi, JP 28 77
MARUYAMA, Kazunobu Shiojiri-shi, JP 8 46
TAKANO, Hiroki Matsumoto-shi, JP 32 90
UCHIYAMA, Kai Matsumoto-shi, JP 1 0

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