semiconductor structure and fabricating method of the same

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United States of America

APP PUB NO 20250089334A1
SERIAL NO

18379674

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Abstract

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A semiconductor includes a substrate. A gate structure is disposed on the substrate. A liner oxide contacts a side of the gate structure. A silicon oxide spacer contacts the liner oxide. An end of the silicon oxide spacer forms a kink profile. A silicon nitride spacer contacts the silicon oxide spacer and a tail of the silicon nitride spacer covers part of the kink profile. A stressor covers the silicon nitride spacer and the substrate.

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Patent Owner(s)

Patent OwnerAddress
UNITED MICROELECTRONICS CORPNO 3 LI-HSIN ROAD 2 SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU CITY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Ti-Bin Tainan City, TW 22 18
Kao, Pei-Hsun Kaohsiung City, TW 4 1
Li, Yi-Fan Tainan City, TW 33 23
Su, Po-Ching Tainan City, TW 8 15
Wang, Chen-Ming Kaohsiung City, TW 7 113
Wu, Chih-Chiang Tainan City, TW 54 373
Yu, Chun-Wei Tainan City, TW 34 66

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