SELECTIVE DEPOSITION OF MASK FOR REDUCING NANO SHEET LOSS

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United States of America

APP PUB NO 20250089330A1
SERIAL NO

18516147

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Abstract

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A method includes forming a protruding fin, and forming a first dielectric layer including a first dielectric layer and a second dielectric layer over the first dielectric layer. The first dielectric layer includes a first top portion on a top surface of the protruding fin, and a sidewall portion on a sidewall of the protruding fin. The second dielectric layer is over the first top portion and the top surface of the protruding fin, and is formed using an anisotropic deposition process. The method further includes forming a dummy gate electrode on the second dielectric layer, forming a gate spacer on a sidewall of the dummy gate electrode, removing the dummy gate electrode, and forming a replacement gate electrode in a space left by the dummy gate electrode.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTDHSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Shu-Han Hsinchu, TW 42 49
Chui, Chi On Hsinchu, TW 525 1267
Lin, Cheng-I Hsinchu, TW 61 464
Tang, Hao-Ming Taipei City, TW 4 0
Wei, Cheng-Yu Taoyuan City, TW 9 29

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