STRUCTURE AND METHOD TO PROVIDE DIELECTRIC LAYER HAVING PLURALITY OF RECESSES WITH DIFFERENT DEPTHS
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United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Sep 8, 2023
filing date -
Sep 8, 2023
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Abstract
A structure according to the disclosure includes a dielectric layer over a substrate and horizontally between a gate terminal and a source/drain (S/D) terminal. The dielectric layer has a first surface proximal to the substrate and a second surface opposite the first surface. The dielectric layer has a plurality of recesses in the second surface. At least some of the plurality of recesses have different depths. A conductive field plate includes a metal layer on the second surface and within the plurality of recesses. The conductive field plate is electrically isolated from the gate terminal and the S/D terminal.
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