HEADPHONE SEALING CUP
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Sep 26, 2024
filing date -
Sep 26, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
An earcup for a headphone, comprising at least one earcup comprising a front opening adapted to be adjacent to the ear of a user of the headphone, a baffle disposed within the earcup to define front and rear cavities, an outer cup arranged to accommodate the rear cavities, a first inner cup arranged within the rear cavity surrounding the front opening, a transducer and an earpad extending around the periphery of the front opening of the earcup arranged to accommodate the front cavity and the ear of the user, and wherein the earcup comprises a second inner cup arranged between the outer cup and the back-volume cup for providing an acoustic barrier between outside noise and the ear of the user.
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