RESONATOR, RESONATOR ASSEMBLY, FILTER, ELECTRONIC DEVICE, METHOD FOR FABRICATING RESONATOR AND PACKAGING STRUCTURE

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United States of America

APP PUB NO 20250088173A1
SERIAL NO

18561458

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Abstract

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A resonator, a resonator assembly, a filter, an electronic device, a method for fabricating the resonator, and a packaging structure are provided. The bulk acoustic resonator includes a substrate, a first electrode, a second electrode, an acoustic reflection structure between the first electrode and the substrate, and a piezoelectric layer arranged between the second electrode and the first electrode. In a direction perpendicular to the substrate, an overlapping region of the acoustic reflection structure, the first electrode, the piezoelectric layer and the second electrode is an active region that is annular. A distance from a point A on an inner edge of the active region to a center of the resonator is D, and a shortest distance from A to an outer edge of the active region is W, where 0.1≤W/D≤10. The heat dissipation rate of the resonator can be improved by modifying W.

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Patent Owner(s)

Patent OwnerAddress
JWL (ZHEJIANG) SEMICONDUCTOR CO LTDHUZHOU ZHEJIANG 313000

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LI, Linping Huzhou. Zhejiang, CN 18 1

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