RESONATOR, RESONATOR ASSEMBLY, FILTER, ELECTRONIC DEVICE, METHOD FOR FABRICATING RESONATOR AND PACKAGING STRUCTURE
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United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Jun 27, 2023
filing date -
Jun 27, 2023
priority date (Note) -
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Abstract
A resonator, a resonator assembly, a filter, an electronic device, a method for fabricating the resonator, and a packaging structure are provided. The bulk acoustic resonator includes a substrate, a first electrode, a second electrode, an acoustic reflection structure between the first electrode and the substrate, and a piezoelectric layer arranged between the second electrode and the first electrode. In a direction perpendicular to the substrate, an overlapping region of the acoustic reflection structure, the first electrode, the piezoelectric layer and the second electrode is an active region that is annular. A distance from a point A on an inner edge of the active region to a center of the resonator is D, and a shortest distance from A to an outer edge of the active region is W, where 0.1≤W/D≤10. The heat dissipation rate of the resonator can be improved by modifying W.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
JWL (ZHEJIANG) SEMICONDUCTOR CO LTD | HUZHOU ZHEJIANG 313000 |
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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
LI, Linping | Huzhou. Zhejiang, CN | 18 | 1 |
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