BULK ACOUSTIC WAVE RESONATOR, MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE

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United States of America

APP PUB NO 20250088166A1
SERIAL NO

18580099

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Abstract

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A bulk acoustic wave resonator, a method for manufacturing a bulk acoustic wave resonator and an electronic device are provided, and belongs to the field of communication technology. The bulk acoustic wave resonator includes: a first base substrate, a first electrode, a piezoelectric layer, and a second electrode; the first electrode is on the first base substrate; the piezoelectric layer is on a side of the first electrode away from the first base substrate; the second electrode is on a side of the piezoelectric layer away from the first electrode; a functional layer is formed on a side of the piezoelectric layer close to the first base substrate and/or on a side of the piezoelectric layer away from the first base substrate; the functional layer is made of a conductive material, and the functional layer is configured to suppress a temperature drift of the bulk acoustic wave resonator.

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Patent Owner(s)

Patent OwnerAddress
BOE TECHNOLOGY GROUP CO LTD100015 NO 10 JIUXIANQIAO ROAD BEIJING CHAOYANG DISTRICT BEIJING CITY BEIJING CITY 100015
BEIJING BOE TECHNOLOGY DEVELOPMENT CO LTD100176 ROOM 407 BUILDING 1 NO 9 DIZE ROAD BEIJING ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE DAXING DISTRICT BEIJING BEIJING CITY BEIJING CITY 100176

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
WANG, Xiyuan Beijing, CN 27 29

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