ISOLATION OF WAVEGUIDE-INTEGRATED DETECTORS USING A BACK END OF LINE PROCESS
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United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Nov 23, 2024
filing date -
Nov 23, 2024
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Abstract
A device includes a substrate and a dielectric layer on the substrate. The device also includes a light sensitive component in the dielectric layer and a trench having a first portion disposed in the substrate and a second portion disposed in the dielectric layer. The trench is adjacent the light sensitive component and includes an adhesion layer in the first portion and the second portion, an optical isolation layer on the adhesion layer, and a first fill material in the first portion and a second fill material in the second portion. The first fill material is characterized by a first coefficient of thermal expansion (CTE) that matches a CTE of the substrate and the second fill material is characterized by a second CTE that matches a CTE of the dielectric layer.
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