HEAT SHRINKABLE CONNECTING COMPONENT AND METHOD OF MANUFACTURING HEAT SHRINKABLE CONNECTING COMPONENT

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250087912A1
SERIAL NO

18727949

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Abstract

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A heat shrinkable connection component according to one embodiment of the present disclosure is used for the purpose of connecting an insulated wire that is obtained by covering a conductor with an insulating layer. This heat shrinkable connection component is provided with a heat shrinkable tube that has a melting point of 210° C. to 250° C. and a pair of sealing parts that are arranged on the inner circumferential surfaces of both end parts of the heat shrinkable tube; and the sealing material of the sealing parts has a shear viscosity of 1,000 Pa·s to 2,000 Pa·s at a shear rate of 100/s at 250° C., and a shear viscosity of 7,000 Pa·s to 70,000 Pa·s at a shear rate of 0.01/s at 215° C.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO ELECTRIC INDUSTRIES LTDOSAKA
SUMITOMO ELECTRIC FINE POLYMER INCKUMAMOTO KOIZUMI PREFECTURE OSAKA PREFECTURE JAPAN TOOK 950 TIMES OF DINGMU WEST IN THE ISHIKAWA DYNASTY SENNAN-GUN OSAKA

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUKUMOTO, Ryota Osaka, JP 75 1159
ISHIBASHI, Keiji Osaka, JP 125 2088
MURATA, Seiichirou Osaka, JP 3 1

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