FRAME DESIGN IN EMBEDDED DIE PACKAGE
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United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Nov 26, 2024
filing date -
Nov 26, 2024
priority date (Note) -
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Abstract
In one example, embedded die package, including a layer having an exposed boundary, wherein at least a portion of the exposed boundary comprises organic material. The package also includes at least one integrated circuit die positioned in the layer and within the exposed boundary. The package also includes a dielectric material positioned in the layer and between the at least one integrated circuit and structure adjacent the at least one integrated circuit.
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