CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
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United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Aug 27, 2024
filing date -
Aug 27, 2024
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Abstract
A chip on film package includes a base film having a first surface and a second surface which are opposite to each other, at least one first conductive line disposed on the first surface and extending in a first direction, at least one second conductive line disposed on the second surface and extending in the first direction, a semiconductor chip disposed on the first surface and connected to the at least one first conductive line through a bump structure, a protective layer covering a part of the first surface and a part of the second surface, and a display panel disposed on the first surface and connected to the at least one first conductive line, wherein the at least one second conductive line is not disposed on the second surface between the semiconductor chip and the display panel.
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