THERMAL APPARATUS FOR AN INTEGRATED CIRCUIT AND METHODS OF OPERATION
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United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Nov 1, 2023
filing date -
Nov 1, 2023
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Abstract
Apparatus and method for improving reliability of an integrated circuit. The apparatus comprises an integrated circuit and a heatsink which is in contact with package of the integrated circuit. A Peltier element comprises a first surface and a second surface and is positioned in a cavity of the heatsink. Based on a first indication from a sensor, a controller applies a first polarity to a first terminal and second terminal of the Peltier element to reduce a temperature of the second surface to cool the integrated circuit and based on a second indication from the sensor, the controller applies a second polarity to the first terminal and second terminal of the Peltier element to increase the temperature of the second surface to heat the integrated circuit.
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