ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
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United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Sep 12, 2023
filing date -
Sep 12, 2023
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Abstract
In one example, an electronic device includes a substrate, an electronic component disposed over the substrate, and an encapsulant disposed over the substrate and the electronic component. A molded heat spreader can be disposed over the encapsulant and can comprise a heat spreader and a mold compound disposed around a lateral side of the heat spreader. A lateral side of the mold compound is coplanar with a lateral side of the encapsulant. Other examples and related methods are also disclosed herein.
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