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Abstract

Embodiments of the present disclosure are directed to a system for monitoring moving and stepping silicon wafers and a method adopts the system. The system includes a first sensing element to monitor whether a gap between adjacent silicon wafers exists, and a second sensing element to monitor whether two silicon wafers are laminated. The first sensing element and the second sensing element are both disposed in a slot where the silicon wafers are turned over, and suspended on a front side of a sorting wheel in the slot and obliquely arranged towards one side of the sorting wheel. The system installed in the narrow space between the cleaning tank and the sorting tank has simple structure and is capable of quickly and accurately monitoring the silicon wafer turnover, and accurately determining whether there is a continuous or laminated silicon wafer during the silicon wafer turnover process.

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First Claim