ETCHING METHODS AND PATTERNED SUBSTRATES MADE USING SAID METHODS

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250087479A1
SERIAL NO

18826539

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Abstract

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Disclosed herein are etching methods, patterned substrates made using said methods, and methods of use of said patterned substrates. For example, described herein are methods comprising: oxidizing at least a portion of a surface of a substrate comprising a group III-V compound, thereby forming an oxidized layer at said portion of the surface; and etching the oxidized layer by exposing the oxidized layer to an etchant; wherein: the group III-V compound comprises one or more group III elements (e.g., Al, Ga, In, B, Sc, Y, or a combination thereof) and a group V element (e.g., N, As, or Sb); the etchant comprises at least one of the group III elements; and the etchant removes oxides by the etchant reacting with the oxide to form a suboxide, which desorbs from the surface.

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Patent Owner(s)

Patent OwnerAddress
OHIO STATE INNOVATION FOUNDATION1524 NORTH HIGH STREET COLUMBUS OH 43201

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dheenan, Ashok Columbus, US 1 0
Rahman, Sheikh Ifatur Columbus, US 1 0
Rajan, Siddharth Columbus, US 20 378
Wriedt, Nathan Columbus, US 1 0

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