SHALLOW ETCHING PROCESS CHAMBER
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United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Jul 24, 2024
filing date -
Jul 24, 2024
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Abstract
A shallow process chamber comprises: a susceptor disposed within a chamber volume 11; a lifting ring 13 formed at the susceptor, and a moving means for moving the lift ring 13 up and down, wherein a wafer W moves up and down above an electrostatic chuck 12 by moving the lift ring 13 up and down.
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