CAPACITOR ASSEMBLY PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE
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United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Mar 20, 2024
filing date -
Mar 20, 2024
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Abstract
A capacitor assembly package structure and a method of manufacturing the same, and an electronic device are provided. The capacitor assembly package structure includes a capacitor assembly, a plurality of first insulating package bodies, a second insulating package body and an electrode assembly. The capacitor assembly includes a plurality of capacitor structures. The capacitor assembly has a plurality of stacking gaps. The first insulating package bodies are respectively received in the stacking gaps of the capacitor assembly. The second insulating package body is configured to cover the first insulating package bodies and the capacitor structures. The electrode assembly includes a first electrode structure and a second electrode structure. A solid content of each first insulating package body is less than a solid content of the second insulating package body so as to reduce the percentage of multiple pores formed in each stacking gap of the capacitor assembly.
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