HIGH CAPACITY MEMORY SYSTEM USING STANDARD CONTROLLER COMPONENT
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United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Oct 2, 2024
filing date -
Oct 2, 2024
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Abstract
The embodiments described herein describe technologies for using the memory modules in different modes of operation, such as in a standard multi-drop mode or as in a dynamic point-to-point (DPP) mode (also referred to herein as an enhanced mode). The memory modules can also be inserted in the sockets of the memory system in different configurations.
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