ALIGNMENT FORMING METHOD FOR HOLOGRAM FILM
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Mar 13, 2025
app pub date -
Sep 12, 2023
filing date -
Sep 12, 2023
priority date (Note) -
Published
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Abstract
An alignment forming method for a hologram film includes a preparing step and an embossing and solidifying step. The preparing step is implemented by providing an embossing mask and an alignment carrier. The embossing mask has a unit pattern layer and a plurality of mask alignment marks. The alignment carrier has a plurality of carrier alignment marks and defines a plurality of embossed regions. The embossing and solidifying step is implemented by sequentially placing a plurality of ultraviolet (UV) solidified resins onto the embossed regions, respectively, and sequentially embossing the UV solidified resins through the unit pattern layer to enable the UV solidified resins to respectively have a plurality of hologram unit patterns. Specifically, when one of the UV solidified resins is embossed, the one of the UV solidified resins is solidified to form one of the hologram unit patterns by a solidifying UV light.
First Claim
all claims..Other Claims data not available
Family
- No Family data available.
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
K LASER TECHNOLOGY INC | NO 1 LI HSIN RD VI SCIENCE-BASED INDUSTRIAL PARK HSINCHU |
International Classification(s)

- 2023 Application Filing Year
- G03F Class
- 1481 Applications Filed
- 296 Patents Issued To-Date
- 19.99 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Linliu, Kung | HSINCHU, TW | 31 | 615 |
# of filed Patents : 31 Total Citations : 615 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 0 Citation Count
- G03F Class
- 0 % this patent is cited more than
- < 1 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Sep 13, 2028 |
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Sep 13, 2032 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 13, 2036 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
- No Legal Status data available.

Matter Detail

Renewals Detail
