LOW STRESS PACKAGING FOR ENVIRONMENTAL SENSORS
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United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Sep 11, 2023
filing date -
Sep 11, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
One or more sensor devices are encapsulated on a top surface of a carrier substrate within an elastomer material. The carrier substrate includes one or more recessed channels adjacent to each sensor device which are filled by a portion of the elastomer material to create flanged areas that are level with the top surface of the carrier substrate. A cover which can include a liquid or gas input port or other related structures can be placed over each sensor device and bonded to the carrier substrate at the flanged areas, creating a seal between the cover and the carrier substrate that surrounds each sensor device.
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