ELECTROCONDUCTIVE ADHESIVE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250084286A1
SERIAL NO

18963230

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electroconductive adhesive comprising a plurality of metal fine particles A that each comprise a protective layer, wherein: (a) the metal fine particles A comprise two or more different types of particles, each coated with a C5-C7 monoalkylamine, wherein the two or more different types of particles comprise: (i) a first type of particle having an average particle diameter of 100-300 nm, and (ii) a second type of particle having an average particle diameter of 30-100 nm; and (b) the protective layer suppresses mutual aggregation of the metal fine particles A. Also disclosed are sintered objects of the electroconductive adhesive, methods of manufacturing the electroconductive adhesive and methods of bonding members with the electroconductive adhesive.

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Patent Owner(s)

Patent OwnerAddress
OSAKA SODA CO LTDOSAKA JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
IWASA, Naruhito Osaka-shi, JP 35 2732
MINAMI, Junichiro Osaka-shi, JP 5 1
MORI, Takamichi Osaka-shi, JP 53 109

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