LIQUID ENCAPSULATION RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
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United States of America
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Mar 13, 2025
app pub date -
Jan 11, 2023
filing date -
Jan 11, 2023
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Abstract
A liquid encapsulation resin composition contains a silica (A), an epoxy resin (B), a curing agent (C), a curing accelerator (D), and a triblock copolymer (E) expressed by the formula (1): X−Y−X, where X is a segment block including a polymer of methyl methacrylate and Y is a segment block including a polymer of monomer components containing 2-ethylhexyl acrylate. The percentage of the triblock copolymer (E) to the total of the epoxy resin (B), the curing agent (C), and the curing accelerator (D) is equal to or greater than 1.0% by mass and equal to or less than 9.5% by mass.
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