REVERSE SOLDERING CONNECTION STRUCTURE OF MICRONEEDLE AND WIRING AND PREPARATION PROCESS THEREFOR
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United States of America
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Issued Date -
Mar 13, 2025
app pub date -
Nov 21, 2024
filing date -
Nov 21, 2024
priority date (Note) -
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Abstract
Disclosed are a reverse soldering connection structure of a microneedle and a wiring and a preparation process thereof. The reverse soldering metal layer of the microneedle is prepared; the reverse soldering metal layer of the wiring is prepared; the reverse soldering metal layer of the microneedle is aligned with the reverse soldering metal layer of the wiring, and they will be pressed to achieve reverse soldering connection between the microneedle and the wiring.
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