SUTURE PROCESSING MACHINE AND METHOD USING ULTRASONIC WAVES

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250082322A1
SERIAL NO

18531113

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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The present disclosure provides a suture processing machine using ultrasonic waves, the suture processing machine including: a supply roll around which a suture to be processed is wound; a distal-end transferer configured to grip and transfer a distal end of the suture supplied from the supply roll; a tension controller configured to control tension of the suture between the distal-end transferer and the supply roll; a mold having an intagliated pattern to form cogs on the suture; both-end transferers installed at both sides of the mold to move the suture to the intagliated pattern of the mold or separate the suture from the intagliated pattern between the supply roll and the distal-end transferer; an ultrasonic wave generator configured to come in contact with the suture in the mold and transmit ultrasonic waves thereto; a first blade portion configured to remove a part of the suture that protrudes to an upper surface of the mold; a separation roller configured to support the suture from a lower side and assist in separation of the suture while the suture is being separated from the intagliated pattern by the both-end transferers; and a second blade portion configured to cut a tip of the suture transferred from the distal-end transferer.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
HYUNDAE MEDITECH CO LTD80 CHEONGJEONG-RO JIJEONG-MYEON WONJU-SI GANGWON-DO 26347 26347

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SONG, Mi Hee Wonju-si, KR 6 0

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