QUANTUM DEVICE AND MANUFACTURING METHOD
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Mar 6, 2025
app pub date -
Jun 25, 2024
filing date -
Jun 25, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A quantum device includes a quantum chip, a first interposer which faces the quantum chip, and bumps provided at locations between the first interposer and the quantum chip, the bumps including first bumps and second bumps, wherein the first bumps contain at least a superconducting material, and the second bumps are made of a different material from the first bumps.
First Claim
Family
International Classification(s)
- No Non-US Classification to display
Cited Art Landscape
Patent Citation Ranking
- Citation Ranking not provided
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully