HEAT DISSIPATION APPARATUS, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE
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United States of America
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Issued Date -
Mar 6, 2025
app pub date -
Nov 19, 2024
filing date -
Nov 19, 2024
priority date (Note) -
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Abstract
A heat dissipation apparatus, a connection structure, and an electronic device. A first heat sink is in thermal contact with a first heat-generating device on a first component, and a second heat sink is in thermal contact with a second heat-generating device on a second component. The first heat sink and the second heat sink are communicated through a pipeline (120), and the three are filled with a cooling medium. Heat generated by either of the first heat-generating device and the second heat-generating device may be transferred to the cooling medium in the heat sink through the corresponding heat sink, and the heat is dissipated outward through a surface of the heat sink.
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