PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
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United States of America
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Issued Date -
Mar 6, 2025
app pub date -
Jul 11, 2024
filing date -
Jul 11, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board includes: a first insulating layer; a first wiring layer embedded in the first insulating layer on one side thereof; a glass layer disposed on the other side, opposite to the one side of the first insulating layer; a second wiring layer disposed on the glass layer; and a first via layer connecting the first wiring layer and the second wiring layer to each other, and including a first via portion penetrating the glass layer and a second via portion penetrating the first insulating layer. In a cross-sectional view of the printed circuit board, at least one of the first via portion and the second via portion has a width becoming substantially narrower toward the first wiring layer.
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