NON-CONTACT COOLING ASSEMBLY FOR COOLING SUBSTRATES
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United States of America
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Issued Date -
Mar 6, 2025
app pub date -
Aug 23, 2024
filing date -
Aug 23, 2024
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Abstract
A non-contact cooling assembly for cooling substrates in equipment front end module in batch is presented. The cooling assembly may comprise a support beam and a plurality of cooling plates, wherein the cooling plates are arranged horizontally stacked and attached to the support beam, and wherein the support beam is configured to move horizontally for cooling substrates. Each of the cooling plates may utilize either thermoelectric cooling effect or cooling fluid for cooling the cooling plates and a cooling plate is placed at a first position (distal position) at first and it moves to a second position (proximal position) for more effective substrate cooling.
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