MULTILAYER ELECTRONIC COMPONENT
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United States of America
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Issued Date -
Mar 6, 2025
app pub date -
Aug 26, 2024
filing date -
Aug 26, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic component includes a stack, a first inductor, a second inductor, a third inductor, and a shield conductor. The shield conductor includes a first conductor part provided on a side surface of the stack and a second conductor part provided on a side surface of the stack. The electronic component further includes a first connecting conductor that connects two columnar conductors of the first inductor and the first conductor part, a second connecting conductor that connects two columnar conductors of the second inductor and the second conductor part, and a third connecting conductor that connects two columnar conductors of the third inductor and the first conductor part.
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