COMPLIANT ELECTRICAL INTERCONNECT ARRAYS USING COPPER NANO-WIRES (CUNWS) IN POLYMERIC PRE-FORM ATTACHMENT LAYER
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United States of America
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Mar 6, 2025
app pub date -
Sep 3, 2024
filing date -
Sep 3, 2024
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Abstract
Embodiments of the present disclosure pertain to a material that includes: (1) a first copper-based layer; (2) a copper nanowire layer above the first copper-based layer, which generally includes a plurality of copper nanowires embedded with a polymer; and (3) a second copper-based layer positioned above the copper nanowire layer such that the copper nanowire layer is sandwiched between the first copper-based layer and the second copper-based layer. Additional embodiments of the present disclosure pertain to methods of forming a material of the present disclosure.
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