VIBRATION ISOLATION ASSEMBLIES FOR ELECTRONIC DEVICES
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United States of America
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Issued Date -
Mar 6, 2025
app pub date -
Aug 30, 2023
filing date -
Aug 30, 2023
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Abstract
Vibration isolation can be provided for a vibration sensitive component to be bonded to electronic circuit boards or other surfaces by an assembly that includes two substrates with rigid portions that are electrically coupled to each other via a flexible interconnect. The rigid portions of the two substrates are bonded together via an elastic structure in a stacked arrangement with the first substrate above the second substrate. The flexible interconnect electrically couples the first substrate to the second substrate and the second substrate is configured to be bonded and electrically coupled to an electronic circuit board or other larger substrate via contacts on a surface of the rigid portion of the second substrate. The vibration sensitive component can be bonded to the rigid portion of the first substrate and couped to the flexible interconnect via the first substrate, thereby coupling it to the second substrate and the larger substrate.
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