Power converter package with shielding against common mode conducted emissions
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Mar 6, 2025
app pub date -
Nov 19, 2024
filing date -
Nov 19, 2024
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Abstract
The disclosure relates to a power converter package (100) for converting a first DC voltage and a second DC voltage into a common AC voltage. The power converter package comprises: a first power semiconductor (130) and a second power semiconductor (140); a first substrate (110); and a second substrate (120). The first substrate (110) comprises a first supply voltage area (113) being formed to supply the first DC voltage and a second supply voltage area (114) being formed to supply the second DC voltage. The first substrate (110) comprises a base metal area (115) being arranged on a first substrate lower main face (112). The base metal area (115) is configured to extract dissipated heat from the first power semiconductor (130) and the second power semiconductor (140). The second substrate (120) comprises an AC voltage output area (150) formed to provide the AC voltage.
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