WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
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United States of America
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Issued Date -
Mar 6, 2025
app pub date -
Sep 3, 2024
filing date -
Sep 3, 2024
priority date (Note) -
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Abstract
A wiring substrate includes an insulating layer and a protruding electrode. The insulating layer has a recess formed in the upper surface of the insulating layer. The protruding electrode is partly buried in the insulating layer to protrude in the recess. The width of the protruding electrode is constant in a sectional view of the protruding electrode. The upper surface of the protruding electrode is positioned lower than the upper surface of the insulating layer.
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