CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
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United States of America
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Issued Date -
Mar 6, 2025
app pub date -
Jan 3, 2023
filing date -
Jan 3, 2023
priority date (Note) -
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Abstract
A circuit board according to an embodiment includes an insulating layer having a concave portion on an upper surface thereof; a first circuit pattern layer disposed in the concave portion of the insulating layer; and a protective layer disposed on the first circuit pattern layer; wherein the first circuit pattern layer includes: a first metal layer, and a second metal layer disposed on the first metal layer to fill a stepped portion between an upper surface of the first metal layer and an upper surface of the insulating layer, and the protective layer includes an opening overlapping the second metal layer in a vertical direction.
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