PACKAGE SUBSTRATE EMPLOYING FILM SUBSTRATE AND AN OUTER PRE-IMPREGNATED (PPG) SUBSTRATE(S) TO SUPPORT HIGH DENSITY BUMP AND WIRE BOND CONNECTIONS, AND RELATED HYBRID INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS
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United States of America
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Issued Date -
Mar 6, 2025
app pub date -
Aug 30, 2023
filing date -
Aug 30, 2023
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Abstract
Hybrid package substrates employing film metallization layers with outer pre-impregnated (PPG) region(s) to support high density bump and wire bond connections for respective bump and wire bond connected dies in the IC package, and related hybrid integrated circuit (IC) packages and fabrication methods are disclosed. The package substrate includes film metallization layers of a softer, flexible material that can more easily be patterned to support formation of high density, reduced pitch metal interconnects to support finer bump pitch connections to a bottom, first die(s) in a die region of the package substrate. The package substrate also includes one or more PPG regions a PPG metallization layer(s) adjacent to the die region of the package substrate that reinforces the film metallization layers and also supports the formation of wire bond pads for wire bond connections to an upper, second die(s) in the hybrid IC package.
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