Importance

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Abstract

A semiconductor power module including a plurality of inverter units, each including power chips, an AC terminal, a DC positive terminal, and a DC negative terminal, an upper surface of the AC terminal being connected to the power chips and having first heat dissipation columns arranged on a lower surface, an upper surface of the DC positive terminal being connected to the power chips and having a second heat dissipation columns arranged on a lower surface; and a liquid tank having a groove for containing a coolant. The AC terminal and DC positive terminal lower surfaces face the groove, the first and second heat dissipation columns extending into the groove, and the coolant being an insulating liquid. Heat from the semiconductor power module is not transferred through the insulating layer, but is directly transferred to the coolant through the terminals, which provides an advantage of high heat dissipation efficiency.

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First Claim