LEAK-PROOF HEAT DISSIPATION STRUCTURE OF HIGH THERMAL CONDUCTIVITY MATERIALS
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United States of America
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Mar 6, 2025
app pub date -
Jan 5, 2024
filing date -
Jan 5, 2024
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Abstract
An improved leak-proof heat dissipation structure of high thermal conductivity materials includes an insulating film layer, a high thermal conductivity thermal interface material layer, a first flexible material composite layer, a second flexible material composite layer and a radiator. The insulating film layer has a film opening at the center. The high thermal conductivity thermal interface material layer has its body close to the heat source and located above the chip body. The first flexible material composite layer is set above the insulating film layer, and has a first opening at the center. The second flexible material composite layer is provided below the insulating film layer, and has a second opening at the center. The radiator is placed on the first flexible material composite layer, and has a boss at the bottom and multiple storage grooves on the boss.
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