METHOD FOR IMPROVED SILICON DEPOSITION

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250079159A1
SERIAL NO

18815701

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The technology of the present disclosure generally relates to the field of semiconductor devices. More particularly, semiconductor structures, systems, and methods for producing the same, comprising surface-modified silicon layers formed by reacting a deposited silicon layer with a halide reactant. The system comprising one or more reaction chamber constructed and arranged to hold a substrate; a silicon precursor vessel constructed and arranged to contain and evaporate a silicon precursor; a halide reactant vessel constructed and arranged to contain and evaporate a halide reactant; an exhaust source; and a controller; wherein the controller is configured to control the flow of said silicon precursor and said halide reactant into said reaction chamber, thereby forming a surface-modified silicon layer on said substrate.

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Patent Owner(s)

Patent OwnerAddress
ASM IP HOLDING BVALMERE

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Houben, Kelly Lubbeek, BE 14 955
Jongbloed, Bert Oud-Heverlee, BE 58 6646
Pierreux, Dieter Pepingen, BE 71 7645
Van, Aerde Steven Tielt-Winge, BE 11 848

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