MULTILAYER ELECTRONIC COMPONENT
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United States of America
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Issued Date -
Mar 6, 2025
app pub date -
Aug 14, 2024
filing date -
Aug 14, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic component includes a stack, a second inductor, and a shield conductor. The shield conductor includes a first conductor part provided on a side surface of the stack and a second conductor part provided on a side surface of the stack. A first end of a conductor layer of the second inductor is located at a position closer to the first conductor part. A second end of the conductor layer is located at a position closer to the second conductor part. Spacing between the first end and the first conductor part is greater than spacing between the second end and the second conductor part.
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