INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FORMING AND OPERATING THE SAME

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United States of America

APP PUB NO 20250078893A1
SERIAL NO

18240852

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Abstract

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The integrated circuit structure includes a substrate and a memory cell over the substrate. The memory cell includes a channel layer, a first doped region, a second doped region, a first ferroelectric layer, and a first gate layer. The first doped region is at a first side of the channel layer and doped with a first dopant being of a first conductivity type. The second doped region is at a second side of the channel layer opposing the first side and doped with a second dopant being of a second conductivity type different from the first conductivity type. The ferroelectric layer is over the channel layer and between the first and second doped regions. The gate layer is over the ferroelectric layer.

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Patent Owner(s)

Patent OwnerAddress
MACRONIX INTERNATIONAL CO LTDNO 16 LI-HSIN ROAD SCIENCE-BASED INDUSTRIAL PARK HSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Wei-Chen Taoyuan City, TW 80 467
DOBHAL, Rachit New Taipei City, TW 1 0
LEE, Dai-Ying Hsinchu County, TW 40 102
LIU, Chee-Wee Taipei City, TW 142 1392
YEH, Teng-Hao Zhubei City, TW 98 864
ZHAO, Zefu Taipei City, TW 2 0

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