SYSTEMS, APPARATUSES, AND METHODS FOR FILM THICKNESS CONTROL FOR INTEGRATED PHOTONICS
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United States of America
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Mar 6, 2025
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Sep 4, 2024
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Sep 4, 2024
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Embodiments of the disclosure provide apparatuses, systems, and methods related to controlling film thickness in photonic-integrated apparatus. In some embodiments, a bottom cladding layer is deposited on a substrate, a thickness map of the bottom cladding layer is generated, thickness trimming is performed on the bottom cladding layer based on the thickness map for the bottom cladding layer; a waveguide core layer is deposited on the bottom cladding layer, a thickness map of the waveguide core layer is generated, thickness trimming is performed on the waveguide core layer based on the thickness map for the bottom waveguide core layer; a top cladding layer is deposited on the waveguide core layer, a thickness map of the top cladding layer is generated; and thickness trimming is performed on the top cladding layer based on the thickness map for the top cladding layer.
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